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The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-cal
Analyse Et Caractérisation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D
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The 3D integration is the most promising technological solution to track the level of integration dictated by Moore's Law (see more than Moore, Moore versus mor
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As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and interne
Caractérisation et modélisation électrique des phénomènes de couplage par les substrats de silicium dans les empilements 3D de circuits intègrés
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Afin d'améliorer les performances électriques dans les circuits intégrés en 3D, une large modélisation électromagnétique et une caractérisation haute fr
Acta electronica
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