Designing Tsvs For 3d Integrated Circuits
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Language: en
Pages: 82
Pages: 82
Type: BOOK - Published: 2012-09-23 - Publisher: Springer Science & Business Media
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel techni
Language: en
Pages: 573
Pages: 573
Type: BOOK - Published: 2012-11-27 - Publisher: Springer Science & Business Media
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimension
Language: en
Pages: 328
Pages: 328
Type: BOOK - Published: 2014-11-12 - Publisher: CRC Press
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration req
Language: en
Pages: 488
Pages: 488
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 260
Pages: 260
Type: BOOK - Published: 2013-11-19 - Publisher: Springer Science & Business Media
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as verti