Reflow Soldering
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Language: en
Pages: 295
Pages: 295
Type: BOOK - Published: 2020-07-02 - Publisher: Elsevier
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. Th
Language: en
Pages: 288
Pages: 288
Type: BOOK - Published: 2002-01-24 - Publisher: Elsevier
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i
Language: en
Pages: 282
Pages: 282
Type: BOOK - Published: 2002-01-11 - Publisher: Newnes
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its i
Language: en
Pages: 122
Pages: 122
Type: BOOK - Published: 1997 - Publisher: New Age International
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Ha
Language: en
Pages: 434
Pages: 434
Type: BOOK - Published: 1994-01-31 - Publisher: Springer Science & Business Media
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as