3d Ic Integration And Packaging
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Language: en
Pages: 481
Pages: 481
Type: BOOK - Published: 2015-07-06 - Publisher: McGraw Hill Professional
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for inc
Language: en
Pages: 379
Pages: 379
Type: BOOK - Published: 2013-11-05 - Publisher: World Scientific
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integr
Language: en
Pages: 513
Pages: 513
Type: BOOK - Published: 2021-05-17 - Publisher: Springer Nature
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and
Language: en
Pages: 220
Pages: 220
Type: BOOK - Published: 2016-04 - Publisher: Spie Society of Photo-Optical Instrumentation Engineers (Spie
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS
Language: en
Pages: 640
Pages: 640
Type: BOOK - Published: 2010-10-22 - Publisher: McGraw Hill Professional
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliabilit