Advanced Flip Chip Packaging

Advanced Flip Chip Packaging
Author :
Publisher : Springer Science & Business Media
Total Pages : 562
Release :
ISBN-10 : 9781441957689
ISBN-13 : 1441957685
Rating : 4/5 (89 Downloads)

Book Synopsis Advanced Flip Chip Packaging by : Ho-Ming Tong

Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.


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