Electronic Packaging Science and Technology

Electronic Packaging Science and Technology
Author :
Publisher : John Wiley & Sons
Total Pages : 340
Release :
ISBN-10 : 9781119418313
ISBN-13 : 1119418313
Rating : 4/5 (13 Downloads)

Book Synopsis Electronic Packaging Science and Technology by : King-Ning Tu

Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-29 with total page 340 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.


Electronic Packaging Science and Technology Related Books

Electronic Packaging Science and Technology
Language: en
Pages: 340
Authors: King-Ning Tu
Categories: Science
Type: BOOK - Published: 2021-12-29 - Publisher: John Wiley & Sons

DOWNLOAD EBOOK

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip
Electronic Equipment Packaging Technology
Language: en
Pages: 285
Authors: Gerald L. Ginsberg
Categories: Science
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role
Essentials of Electronic Packaging
Language: en
Pages: 0
Authors: Puligandla Viswanadham
Categories: Technology & Engineering
Type: BOOK - Published: 2011 - Publisher: American Society of Mechanical Engineers

DOWNLOAD EBOOK

ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging
Advanced Materials for Thermal Management of Electronic Packaging
Language: en
Pages: 633
Authors: Xingcun Colin Tong
Categories: Technology & Engineering
Type: BOOK - Published: 2011-01-05 - Publisher: Springer Science & Business Media

DOWNLOAD EBOOK

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in
Electronic Packaging
Language: en
Pages: 0
Authors: John H. Lau
Categories: Electronic packaging
Type: BOOK - Published: 1998 - Publisher: McGraw-Hill Professional Publishing

DOWNLOAD EBOOK

Here is the ultimate electronic packaging resource, in which luminaries from the four intertwined disciplines of packaging present a one-stop guide to the state