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SiP System-in-Package Design and Simulation
Language: en
Pages: 507
Authors: Suny Li (Li Yang)
Categories: Technology & Engineering
Type: BOOK - Published: 2017-07-12 - Publisher: John Wiley & Sons

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design
Signal Integrity Issues and Printed Circuit Board Design
Language: en
Pages: 418
Authors: Douglas Brooks
Categories: Computers
Type: BOOK - Published: 2003 - Publisher: Prentice Hall Professional

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Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how hi
Atm Product Directory Update
Language: en
Pages: 344
Authors:
Categories:
Type: BOOK - Published: - Publisher: Information Gatekeepers Inc

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MicroSystem Based on SiP Technology
Language: en
Pages: 867
Authors: Suny Li
Categories: Technology & Engineering
Type: BOOK - Published: 2022-05-28 - Publisher: Springer Nature

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This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total
Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields
Language: en
Pages: 461
Authors: Mei Song Tong
Categories:
Type: BOOK - Published: - Publisher: Springer Nature

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