Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
| Author | : Ting Y. Tsui |
| Publisher | : |
| Total Pages | : 498 |
| Release | : 2006 |
| ISBN-10 | : UOM:39015064810438 |
| ISBN-13 | : |
| Rating | : 4/5 (38 Downloads) |
Book Synopsis Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects by : Ting Y. Tsui
Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: