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Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliabilit
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Assembly and Reliability of Lead-Free Solder Joints
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Through-Silicon Vias for 3D Integration
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A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics in