Tsv 3d Rf Integration
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Language: en
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Type: BOOK - Published: 2022-04-27 - Publisher: Elsevier
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-
Language: en
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Language: en
Pages: 376
Pages: 376
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Language: en
Pages: 181
Pages: 181
Type: BOOK - Published: 2014-08-21 - Publisher: Springer
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model acco
Language: en
Pages: 488
Pages: 488
Type: BOOK - Published: 2019-05-06 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate