Download or read book 3D IC Devices, Technologies, and Manufacturing written by Hong Xiao and published by Spie Society of Photo-Optical Instrumentation Engineers (Spie. This book was released on 2016-04 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging.