Advances In 3d Integrated Circuits And Systems
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Language: en
Pages: 392
Pages: 392
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Language: en
Pages: 211
Pages: 211
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
Language: en
Pages: 798
Pages: 798
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
Language: en
Pages: 280
Pages: 280
Type: BOOK - Published: 2010-11-08 - Publisher: Springer Science & Business Media
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural des
Language: en
Pages: 376
Pages: 376
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling